Publications of Richard Snogren

  • Embedded Ceramic Resistors and Capacitors in PWB- Process and Performance. Co-Authors: John Felton and Jiming Jhou. IPC Conference. October 2001.
  • Embedded Passives, A Review. IPC Designers Learning Symposium. October 2002. Toronto, Canada.
  • Embedded Passives, The Next Leap. PCFab. November 2002.
  • Embedding Ceramic Thick-Film Resistors and Capacitors in Printed Circuit Boards. SMTA. March 2003. Chicago, IL.
  • Designing with Ceramic Thick-Filmed Embedded Passives – Two Open Gaps. IPC International Conference on Embedded Passives. June 2003. Northbrook, IL.
  • Embedded Passives – A Novel Approach Using Ceramic Thick Film Technology. International Electronics Packaging Technical Conference and Exhibition. July, 2003. Maui, HI.
  • Designing Ceramic Thick-Filmed Capacitors for Embedding in Printed Circuit Boards. IPC Works Conference. October 2003. Minneapolis, MN.
  • Drivers and Materials: In the First of a Series of Columns, We Take a Look at the Embedded Materials Landscape. Printed Circuit Design and Manufacture. October 2003.
  • Will Bare Boards Containing Embedded Passives Be Cheaper?. IPC Designer’s Learning Symposium. November 2003.
  • Manufacturing Considerations for Embedded Passives: Designing and Building with EP’s Means Knowing the Tolerances of Different Material Sets. Printed Circuit Design and Manufacture. November 2003.
  • Paying to Spend Less: Why Embedded Parts Can Reduce Overall System Costs Even While Bare-Board Prices Rise. Printed Circuit Design and Manufacture. December 2003.
  • Designing Resistors to Embed. IPC Works Conference 2004.
  • Designing Embedded Resistors and Capacitors. IPC Expo. 2004.
  • UAL Flight 896, 16G: How a Flight from Hong Kong Tripped My Logic in Last Month’s Column. January 2004.
  • When to Embed: Advice on Factors to Consider and Questions to Ask Before Layout. Printed Circuit Design and Manufacture. February 2004.
  • Embedded Passives – An Overview: Drivers, Materials and Manufacturing. US Tech. February 2004.
  • Cost Modeling or Price Comparing? Complex Tools are not Needed if What You Want is to Compare Prices. Printed Circuit Design and Manufacture. March 2004.
  • Simple Cost Modeling for EP’s: A Continuation of Last Month’s Discussion on How to Create and Accurate, User-friendly Methodology. Printed Circuit Design and Manufacture. April 2004.
  • Thermal Issues and Properties of Embedded Resistors: Need Deck. Printed Circuit Board Design and Manufacture. May 2004.
  • Designing Embedded Resistors. IPC 2nd International Embedded Passives Conference. June 2004.
  • Conductor Heating of Embedded Resistors. Co-Author: Mike Jouppi. Printed Circuit Board Design and Manufacture. June 2004.
  • Variables of Resistor Heating. Co-Author: Mike Jouppi. Printed Circuit Design and Manufacture. July 2004.
  • Baking a Pie: A Review of a Recent Embedded Passives Conference Shows the Market Smells Good. Printed Circuit Design and Manufacture. August 2004.
  • E/CIT Update: A Program Hopes to Drive Technology Development and Keep US Military Contracts in the US. Printed Circuit Design and Manufacture. September 2004.
  • Embedded Passives in Printed Circuit Boards. Defence Manufacturing Conference. December 2004.
  • Embedded Resistor Design Guidelines. Co-Author Mike Jouppi. Printed Circuit Design and Manufacture. December 2004.
  • Embedded Passive Test Vehicle Update. Printed Circuit Design and Manufacture. October 2005.
  • Design, Build, and Test PCB’s for free? You Heard Right! CircuiTree WS. February 2006.
  • E/CIT Emulator Project Article (for Getting Embedded). IPC Conference. April 2006.
  • Experiencing Unique Training: How to Design and Build a PCB with Embedded Passive Components – in Two Days. Printed Circuit Design and Manufacture. November 2006.
  • E/CIT Active OEMs on Embedded Passives Testing. Printed Circuit Design and Manufacture. November 2006.
  • NAVSEA Crane ECIT Program. Printed Circuit Design and Manufacture. November 2006.